Lingming Photonics releases the first dToF sensor chip with 3D stacking technology

Shenzhen Lingming Photonics Technology Co., Ltd. today released the first dToF single photon imaging sensor (SPAD image sensor, SPADIS) using the world’s advanced back-illuminated 3D stacking process technology, and its comprehensive performance has reached the international first-class level.

3D sensing technology is expanding to cutting-edge applications such as consumer electronics, automotive electronics, and industrial control. Among them, direct time of flight (dToF) technology is at the forefront of 3D sensing, with its superior ranging capabilities, Power consumption economy and anti-interference ability have attracted more and more attention from the industry in recent years. Especially after Apple released a mobile phone ecosystem equipped with dToF imaging solution (Lidar Scanner) in 2020, and Sony released a car Lidar solution equipped with dToF solution, the market demand for advanced dToF imaging chips began to explode.

The dToF single-photon imaging sensor codenamed ADS3003 released by Lingming Photonics this time has a physical resolution of 240*160 and an area size of 0.35 inches. It adopts a back-illuminated 3D stacking process, and the measurement distance can reach 15 meters in an indoor environment. It can reach up to 5 meters in the environment, and the frame rate can reach up to 50fps. It can achieve full range sub-centimeter ranging accuracy and depth resolution, fully satisfying from smart phones, AR equipment, to sweepers, smart home IOT, and industrial measurement The needs of the field. Linghuang Photonics also launched a dToF module solution based on this chip simultaneously with OFILM.

It is reported that Linghuang Photonics ADS3003 is the first dToF sensor chip using 3D stacking technology. The 3D stacking technology allows the photon detector (SPAD) part and the logic circuit part of the sensor chip to be processed on two wafers separately, and combined into a complete chip through metal hybrid bonding. This design allows the chip to obtain a larger circuit area without increasing the area, allowing the photon detector and logic circuit to use the most suitable process nodes respectively, achieving higher SPAD photon detection efficiency PDE and higher resolution , Lower power consumption and better overall performance. Previously, this process technology was only seen in the Lidar Scanner chip jointly developed by Apple and Sony for the iPad Pro and iPhone 12 Pro. Lingxuan Photon ADS3003 has exceeded the level of this chip in terms of resolution and ranging capabilities.

Linghuang Photonics ADS3003 chip will begin to provide customers with samples and test kits in July 2021. At present, this chip has preliminary mass production capacity.

Leave a Reply