Samsung Electromechanical develops industry’s thinnest 3-slot MLCC for 5G smartphones

Samsung Electromechanical announced that it has developed a 0.65mm ultra-thin 3-slot MLCC, which is 18% thinner than previous products, and has begun to supply global smart phone companies.

MLCC (Multi-layer Ceramic Capacitors) is the English abbreviation of chip multilayer ceramic capacitors. It is the core component of electrical equipment. It controls the stable flow of current in electrical product circuits. Compared with ordinary MLCC, three-way MLCC has an additional grounding socket, which can easily reduce high-frequency power noise.

In the area of ​​smart phones, each component of the circuit board can be as small as possible. Therefore, today’s demand for thinner, multifunctional and high-performance components is also growing.

Due to the limitation of the internal dielectric layer, the width of the previous product was 0.8mm. Samsung Mechatronics has reduced the previous thickness by 18% by applying independent thin-layer molding technology and ultra-fine dielectric layers, thereby increasing the freedom of smartphone design. The new product effectively eliminates high-frequency noise from the application processor (AP) power supply unit, and improves the internal space efficiency by replacing 3 to 4 general-purpose MLCCs.

Kim Doo-young, head of Samsung Electromechanical Division, said: “With the commercialization of 5G mobile communications and the electrification of automobiles, the demand for miniature, high-performance, and highly reliable MLCCs has soared. Samsung Mechatronics will enhance its unique technologies. To ensure a leading position in the market, including internal development of core materials, internalization of equipment and manufacturing capabilities.”

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